s71ns128ja0 Advanced Micro Devices, s71ns128ja0 Datasheet - Page 9

• Manufacturer Part Number: s71ns128ja0
• Description: Stacked Multi-chip Product Mcp , 128 Megabit 8 M X 16-bit And 64 Megabit 4 M X 16-bit , 110 Nm Cmos 1.8 Volt-only Simultaneous Read/write, Burst Mode Flash Memories With 16 Megabit 1 M X 16-bit Psram
• Manufacturer: Advanced Micro Devices

PHYSICAL DIMENSIONS–S71NS128JA0
NLA048—48-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA)
10 x 11
* For reference only. BSC is an ANSI standard for Basic Space Centering
February 5, 2004 31136A1
PACKAGE
JEDEC
SYMBOL
A1 CORNER
INDEX MARK
SD / SE
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
10
A
A1
10.85
1.05
0.20
0.85
9.85
0.25
MIN
9.95 mm x 10.95 mm NOM
mm Package
PACKAGE
4.50 BSC.
1.50 BSC.
0.50 BSC.
0.25 BSC.
NLA 048
10.95
NOM
0.91
9.95
0.30
N/A
10
48
---
---
---
4
SEATING PLANE
TOP VIEW
SIDE VIEW
10.05
11.05
MAX
1.20
0.97
0.35
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
P r e l i m i n a r y
NOTE
S71NS128JA0/S71NS064JA0
A
E
B
A2
C
0.08
1.00
0.10
1.00
e
C
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
NF2
NF7
1.00
NF3
NF5
1.00
10
9
BOTTOM VIEW
φb
φ0.05
φ0.15
8
7
6
M
M
6
D1
C
C
5
A
4 3
SD
B
7
2
1
NF4
NF6
NF1
NF8
A
B
C
D
7
3297 \ 16-038.22a1
A1 CORNER
SE
E1
9