tea5761uk NXP Semiconductors, tea5761uk Datasheet - Page 41

• Manufacturer Part Number: tea5761uk
• Description: Tea5761uk Low-voltage Single Chip Fm-stereo Radio
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9397 750 13451
Product data sheet
16.2.3 Rework
16.2.4 Cleaning
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip may be damaged. In that case it is recommended
not using the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. The surface of the substrate
should be carefully cleaned and all solder and flux residues and/or underfill removed.
When a new chip is placed on the substrate, use the flux process instead of solder on the
solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the
substrate. Place and align the new chip while viewing with a microscope. To reflow the
solder, use the solder profile shown in this document.
Cleaning can be done after reflow soldering.
Rev. 01 — 2 August 2006
Low voltage single-chip FM stereo radio
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TEA5761UK
41 of 44