ak4368 AKM Semiconductor, Inc., ak4368 Datasheet - Page 59

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ak4368

Manufacturer Part Number
ak4368
Description
Dac With Built-in Pll & Hp-amp
Manufacturer
AKM Semiconductor, Inc.
Datasheet
ASAHI KASEI
MS0529-E-00
Package & Lead frame material
Package molding compound:
Interposer material:
Solder ball material:
4.0 ± 0.1
BT resin
Epoxy
SnAgCu
PACKAGE
0.08 S
- 59 -
41 - φ 0.3 ± 0.05
φ 0.15
S
M
S
AB
0.5
7
6
5
3.0
4
3
2
[AK4368EG]
1
G
2006/07
A
B
C
D
E
F
0.5
B

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