lf3321qc9 LOGIC Devices Incorporated, lf3321qc9 Datasheet - Page 26

• Manufacturer Part Number: lf3321qc9
• Description: Horizontal Digital Image Filter
• Manufacturer: LOGIC Devices Incorporated

DEVICES INCORPORATED
LOGIC Devices Incorporated
Notes
1. Maximum Ratings indicate stress specifications only. Functional operation of these products at values
beyond those indicated in the Operating Conditions table is not implied. Exposure to maximum rating
conditions for extended periods may affect reliability.
2. The products described by this specification include internal circuitry designed to protect the chip from
damaging substrate injection currents and accumulations of static charge. Nevertheless, conventional
precautions should be observed during storage, handling, and use of these circuits in order to avoid
exposure to excessive electrical stress values.
3. This device provides hard clamping of transient undershoot. Input levels below ground will be clamped
beginning at –0.6V. The device can withstand indefinite operation with inputs or outputs in the range of
–0.5V to +5.5V. Device operation will not be adversely affected, however, input current levels will be well
in excess of 100 mA.
4. Actual test conditions may vary from those designated but operation is guaranteed as specified.
5. Supply current for a given application can be accurately approximated by:
where
6. Tested with outputs changing every cycle and no load, at a 40 MHz clock rate.
7. Tested with all inputs within 0.1V of VCC or Ground, no load.
8. These parameters are guaranteed but not 100% tested.
9. AC specifications are tested with input transition times less than 3ns, output reference levels of 1.5V
(except tDIS test), and input levels of nominally 0 to 3.0V. Output loading may be a resistive divider which
provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively,
a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of
1.5V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed.
This device has high-speed outputs capable of large instantaneous current pulses and fast turn-on/turn-off
times. As a result, care must be exercised in the testing of this device. The following measures are
recommended:
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to the Device
Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester
common, and device ground and tester common.
b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers.
c. Input voltages on a test fixture should be adjusted to compensate for inductive ground and VCC noise to
maintain required DUT input levels relative to the DUT ground pin.
10. Each parameter is shown as a minimum or maximum value. Input requirements are specified from the
point of view of the external system driving the chip. Setup time, for example, is specified as a minimum
since the external system must supply at least that much time to meet the worst-case requirements of all
parts. Responses from the internal circuitry are specified from the point of view of the device. Output
delay, for example, is specified as a maximum since worst-case operation of any device always provides
data within that time.
NCV F
4
2
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
26
Horizontal Digital Image Filter
Improved Performance
Video Imaging Products
Feb 5, 2003 LDS.3321-A
LF3321