pa2423mb SiGe Semiconductor, pa2423mb Datasheet - Page 7

• Manufacturer Part Number: pa2423mb
• Description: 2.4 Ghz Bluetooth Class 1 Power Amplifier Ic
• Manufacturer: SiGe Semiconductor

Package Dimensions
The PA2423MB is packaged in a 3.0 mm x 3.0 mm 8 lead MSOP package. The underside of the package is an exposed die-pad structure. This allows
for direct soldering to the PCB for enhanced thermal conductivity. The package dimensions are shown in the drawing below.
DOC# 05PDS001 S Rev 9 S
07/26/2001
2.4 GHz Bluetooth Class 1 Power Amplifier IC
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Production Information
PA2423MB