l99pm62gxp STMicroelectronics, l99pm62gxp Datasheet - Page 45

• Manufacturer Part Number: l99pm62gxp
• Description: Power Management Ic With Lin And High Speed Can
• Manufacturer: STMicroelectronics

L99PM62GXP
5.4
5.4.1
Note:
Package and PCB thermal data
PowerSSO-36 thermal data
Figure 24. PowerSSO-36 PC board
Layout condition of R
double layer, board dimension 129x60, board Material FR4, Cu thickness 0.070 mm (front
and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm,
Cu thickness on vias 0.025 mm).
th
and Z
th
Doc ID 17639 Rev 3
measurements (board finish thickness 1.6 mm +/- 10% board
Electrical specifications
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