tza3012ahw NXP Semiconductors, tza3012ahw Datasheet - Page 52
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tza3012ahw
Manufacturer Part Number
tza3012ahw
Description
30 Mbits/s Up To 3.2 Gbits/s A-ratetm Fibre Optic Receiver
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3012AHW.pdf
(60 pages)
- Current page: 52 of 60
- Download datasheet (300Kb)
Philips Semiconductors
PACKAGE OUTLINE
2003 May 21
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
30 Mbits/s up to 3.2 Gbits/s
A-rate
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT638-1
max.
100
76
1.2
A
75
y
1
0.15
0.05
A 1
fibre optic receiver
exposed die pad side
1.05
0.95
A 2
e
pin 1 index
0.25
A 3
IEC
b p
H D
0.27
0.17
b p
D h
D
0.20
0.09
w
c
M
D
14.1
13.9
JEDEC
(1)
Z D
0
D h
REFERENCES
X
7.1
6.1
25
51
14.1
13.9
E
50
26
(1)
Z E
E h
7.1
6.1
B
JEITA
b p
scale
52
w
e
v
v
M
0.5
c
M
M
e
B
A
A
E
16.15
15.85
H D
H E
16.15
15.85
H E
10 mm
A
A 2
L
1
A 1
detail X
0.75
0.45
L p
PROJECTION
0.2
EUROPEAN
v
0.08
w
TZA3012AHW
0.08
y
Product specification
Z D
1.15
0.85
ISSUE DATE
L
(1)
L p
01-03-30
03-04-07
Z E
1.15
0.85
SOT638-1
(1)
(A 3 )
7
0
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