tza3019 NXP Semiconductors, tza3019 Datasheet - Page 25

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tza3019

Manufacturer Part Number
tza3019
Description
2.5 Gbits/s Dual Postamplifier With Level Detectors And 2 X 2 Switch
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINES
2001 Jun 25
HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1.0 mm
2.5 Gbits/s dual postamplifier with level
detectors and 2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT547-2
max.
1.2
A
25
32
y
0.15
0.05
A 1
24
1
1.05
0.95
A 2
e
pin 1 index
0.25
A 3
IEC
b
p
heathsink side
2 switch
0.27
0.17
b p
H
D h
D
D
w
0.20
0.09
M
c
D
5.1
4.9
JEDEC
(1)
X
0
Z D
17
8
D h
3.1
2.7
REFERENCES
E
B
5.1
4.9
16
(1)
9
Z E
E h
3.1
2.7
e
EIAJ
b
scale
25
2.5
w
p
v
v
M
0.5
M
M
e
c
A
E
A
B
7.1
6.9
H D
H
E
H E
7.1
6.9
5 mm
A
1.0
A
L
2
A
0.75
0.45
1
L p
PROJECTION
0.2
EUROPEAN
v
detail X
0.08
w
0.08
y
Product specification
Z D
0.89
0.61
TZA3019
ISSUE DATE
L
(1)
L
99-06-15
p
Z E
0.89
0.61
SOT547-2
(1)
(A )
3
7
0

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