tza3019 NXP Semiconductors, tza3019 Datasheet - Page 23

• Manufacturer Part Number: tza3019
• Description: 2.5 Gbits/s Dual Postamplifier With Level Detectors And 2 X 2 Switch
• Manufacturer: NXP Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS
2001 Jun 25
V
IN1
IN1Q
V
n.c.
n.c.
V
IN2
IN2Q
V
GND2A
LOSTH1
LOSTH2
n.c.
LEVEL1
LEVEL2
V
n.c.
TEST
GND2B
V
OUT2Q
SYMBOL
CC1A
CC1A
CC2A
CC2A
ref
CC2B
2.5 Gbits/s dual postamplifier with level
detectors and 2
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
2 switch
+236
+393
+550
+707
+928
+928
COORDINATES
+79
928
928
928
928
928
928
928
928
928
928
707
550
393
236
x
79
+710
+553
+396
+239
+81
239
396
553
710
928
928
928
928
928
928
928
928
928
928
710
553
y
81
(1)
23
Note
1. All x and y coordinates represent the position of the
OUT2
V
n.c.
n.c.
V
OUT1Q
OUT1
V
GND1B
RSSI2
LOS2
RSSI1
LOS1
INV2
INV1
S2
S1
GND1A
CC2B
CC1B
CC1B
SYMBOL
centre of the pad in m with respect to the centre of the
die (see Fig.15).
PAD
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
+928
+928
+928
+928
+928
+928
+928
+928
+707
+550
+393
+236
COORDINATES
+79
236
393
550
707
x
79
Product specification
TZA3019
+239
+396
+553
+710
+928
+928
+928
+928
+928
+928
+928
+928
+928
+928
+81
396
239
y
81
(1)