at88rf1354 ATMEL Corporation, at88rf1354 Datasheet
at88rf1354
Related parts for at88rf1354
at88rf1354 Summary of contents
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... Industrial Operating Temperature: -40° to +85° Description The AT88RF1354 is a smart, high performance ISO/IEC 14443 Type B RF Reader IC. The AT88RF1354 communicates with RFID Transponders or Contactless Smartcards using the industry standard ISO/IEC 14443-2 Type B signal modulation scheme and ISO/IEC 14443-3 Type B frame format. ...
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Introduction 3.1. Block Diagram Figure 1. Block Diagram RFin Modulator C6 ANT ANT Driver Vss_ANT PLL CLKO 13.56 MHz Type B RF Reader 2 Filter Transmit Command Response 13.56 MHz Xtal1 Xtal2 ResetB ISEL Receive SRAM and Logic Registers ...
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... Reference Designs and additional technical information is available in AT88RF1354 Application Notes. The reference designs described in the AT88RF1354 Application Notes include schematics, board designs, and a complete bill of materials. Each reference design has been optimized for reliable, robust communications with cards and tags with antenna dimensions within a specified size range ...
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... Type B standard frame and transmitted on the RF communications channel, along with the CRC. When a response is received from the card, the response frame is decoded by AT88RF1354 and the resulting bytes are stored in SRAM buffer memory CRC or frame format error is detected in the response, then bits are set in the Error Register (EREG) ...
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... All other commands will timeout if no response is received usually not necessary to use the Abort Command to interrupt them. The Clear Command is used to clear the configuration registers and place AT88RF1354 in a known initial state. The Clear Command is usually the first command sent after the reader is powered on and reset. ...
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... Register Summary The AT88RF1354 Command Reference Guide document contains all of the detailed information required by a software developer or embedded systems programmer to use the AT88RF1354 Register Set. See for the AT88RF1354 Command Reference Guide (doc 5150x). Table 2. Register set sorted by address. Register Register ...
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... Communications Protocol Registers AT88RF1354 contains five 16 bit Communication Protocol Registers for configuration of the RF communication protocol. Each register contains a high byte (CPRx_H) and a low byte (CPRx_L). The CPRx_H registers are used to configure the Frame Wait Time. The CPRx_L registers are currently unused (Reserved for Future Use) and must remain set to $00 ...
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... Status Registers AT88RF1354 contains three read-only registers that provide status information. The operational status of the IC is contained in the SREG Register; by reading this register it can be determined if the RF Field is on and if the analog circuits are fully powered up. The RF communication errors flags are stored in EREG; these flags are also returned in the response of RF communication commands. The IDR Register contains the hardware ID revision of the die ...
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Pin List Pin Name 1 V _ANT _ANT SS 3 ANT 4 Xtal1 5 Xtal2 Test1 8 CLKO 9 ResetB 10 ISEL 11 TestD 12 Istat 13 SSB 14 SCK 15 SDI 16 ...
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Power and Ground Pin Descriptions 6.1.1. V [24] CC Supply Voltage for I/O buffers, digital, and analog circuits. V since all digital I/O levels are referenced to V Two V bypass capacitors must be connected between the V CC ...
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... A low level on Istat indicates that the serial interface buffer is empty. Note: Use of Istat for serial communications control is mandatory, and the AT88RF1354 will not accept commands from the host microcontroller when Istat is high. 6.2.5. ResetB [9] Reset Bar input pin ...
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... C6 Antenna bypass capacitor pin. The C6 pin provides power to the antenna circuits and modulates the power level for communications. 6.3.3. RFin [32] RF input pin. RFin is the input to the receiver. A resistor/capacitor filter is used to limit the peak to peak voltage on this pin to a safe level. See the AT88RF1354 reference design for appropriate component values. 6.4. Analog Pin Descriptions 6.4.1. C1 [21] C1 bypass capacitor pin ...
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C5 [6] C5 bypass capacitor pin. Bypass capacitance of 0.33 uF for the digital circuits must be connected between the C5 pin and V . This capacitor must be placed within the package. Any 0.33 uF ...
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Typical Application 7.1. Operating Principle Contactless RF smart cards operating at 13.56 Mhz are powered by and communicate with the reader via inductive coupling of the reader antenna to the card antenna. The two loop antennas effectively form a ...
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... Application In a typical application the AT88RF1354 reader circuitry and the loop antenna are integrated on a single four layer printed circuit board. The host microcontroller and power supply may reside on the same PCB separate PCB depending on the application requirements. The passive components required for the reader IC to function are placed in a small area immediately surrounding the QFN package for optimum RF circuit performance ...
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Electrical Characteristics 8.1. Absolute Maximum Ratings* Absolute Maximum Rating Operating Temperature (case temp) Storage Temperature (case temp) Power Dissipation Maximum Operating Voltage (V Maximum Operating Voltage (V DC Current: V Pin CC DC Current: V _ANT Pin CC HBM ...
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Digital I/O Characteristics Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter V Input Low Voltage IL V Input High Voltage IH Output Low Voltage V OL (except SDI pin in TWI mode) Output High Voltage V OH ...
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TWI Mode Timing Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter t SCK High pulse width HIGH t SCK Low pulse width LOW t Setup time, Data SU;DAT t Hold time, Data HD;DAT t Setup time, Start ...
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Figure 5. SPI Interface timing requirements Standby Mode Timing Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter t Crystal Oscillator start-up time Leaving OSC disabled Standby OSC t Standby Mode Enable Time SDBY t Exit Standby Mode ...
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CLKO Output Timing Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter f CLKO Output Frequency CLKO CLKO Duty Cycle t Rise Time R_CLKO t Fall Time F_CLKO Note: 1. Typical values at 25° C. Values are characterized ...
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... Typical Characteristics The performance of AT88RF1354 is dependent on the reader circuit, the loop antenna design, the board layout, the specifications of the passive components, the quality of the supply voltages, the quality of the ground, the electrical noise in the system, and how the reader circuit is connected to the other system components. The specifications that are affected by these factors are included in this section as typical characteristics since they cannot be guaranteed in all situations ...
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... An Atmel reference design with 13.560 MHz 50 ppm crystal was used to characterize this parameter. 4. Modulation Index is determined by the ML bit setting in the TXC register. 5. Unmodulated Magnetic Field strength is different for each reader antenna and reader board design. See AT88RF1354 Application Notes. 13.56 MHz Type B RF Reader 22 (1) ...
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Receiver Characteristics Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter ETU Elementary Time Unit EGT Extra Guard Time BW Receiver Bandwidth Note: 1. Typical values 35° C. Values are characterized values and not test ...
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... Mechanical 10.1. Thermal Characteristics The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad. °C/W and θ is 30.9 °C/W for this package. JA ψ measures the heat transfer between the QFN package and the PC board more relevant than θ ...
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Package Drawing 8547A−RFID−10/08 13.56 MHz Type B RF Reader 25 ...
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... Ordering Information AT88RF1354 is available in the pin QFN package only. Standard delivery format is bulk, in trays. Tape & reel is also available. Ordering Code AT88RF1354-ZU 36 pin QFN thermal package mm, Green, in Trays AT88RF1354-ZU-T 36 pin QFN thermal package mm, Green, Tape & Reel 13 ...
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... A.1. RF Signal Interface The AT88RF1354 RF communications interface is compliant with the ISO/IEC 14443 part 2 and part 3 Type B signaling requirements when used exactly as described in the AT88RF1354 reference design application notes. Type B signaling utilizes amplitude modulation of the RF field for communication from the reader to the card with NRZ encoded data ...
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A.3. Frame Format Data transmitted by the PCD or PICC is sent as frames. The frame consists of the start of frame (SOF), several bytes of information, and the end of frame (EOF). The SOF and EOF requirements are shown ...
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... ATQB response to the polling command that tells the reader the worst case FWT. The PCD is not permitted to modulate the RF field while waiting for a PICC to respond to a command. Modulation of the RF field during a PICC memory read or write operation may corrupt the operation or cause reset of the PICC. 8547A−RFID−10/08 13 ...
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... PICC, the AT88RF1354 reader automatically computes the CRC on the incoming command, data, and CRC bytes. When transmitting data the AT88RF1354 reader automatically computes the CRC on the outgoing data packet, and inserts it prior to the end of frame. Any CRC error detected by AT88RF1354 is reported to the host microcontroller. ...
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A.9. Magnetic Field Strength ISO/IEC 14443 part 2 defines the minimum and maximum operating magnetic field strength as Hmin and Hmax. A credit card sized (ID-1) PICC is required to operate at all magnetic field strengths between Hmin = 1.5 ...
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... AT88RF1354 in SPI mode. The ISTAT signal is used for handshaking between the microcontroller and RF reader. B.1. SPI Interface The AT88RF1354 SPI interface operates as a slave device in SPI mode 0. In SPI mode 0 the polarity and phase of the serial clock in relation to the data is as follows: SCK is low when IDLE. ...
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... ISTAT will remain high until the last bit of the byte is read, when it will return low. Data on the SDA / SDI line is sampled by the receiving device when the SCK clock is high. Data is allowed to be changed by the transmitting device only when the SCK clock is low. All data must be clocked out of the AT88RF1354 before it can receive a command. ...
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... AT88RF1354. The read bit should be set when retrieving response packets from AT88RF1354. Upon a successful compare of the device address, the AT88RF1354 will pull the SDI output low for 1 bit period, sending a TWI ACK bit address compare is unsuccessful, the device will return to an idle state and the SDA / SDI line will remain pulled up by the external pull-up resistor, effectively sending a TWI NACK bit ...
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... It should be emphasized that this is just a guideline to help the user in developing the proper board design and surface mount process. Actual studies as well as development effort maybe needed to optimize the process as per user's surface mount practices and requirements. Figure D-1. AT88RF1354 6x6 mm QFN package b 3 ...
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... It is recommended that an array of thermal vias should be incorporated at a 1.0 to 1.2 mm pitch with a via diameter of 0.3 to 0.33 mm. For optimum heat transfer it is recommended that a minimum of nine vias be placed in the thermal pad, and a 1 ounce copper thickness be used on all PCB layers on AT88RF1354 readers. D.3.3. Solder Masking Consideration The pads on the printed circuit board are either solder mask defined (SMD) or non solder mask defined (NSMD) ...
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Figure D-2. Solder mask definition for perimeter lands. 0.5 mm and Higher Pitch Parts For the cases where the thermal land dimensions are close to the theoretical maximum discussed above recommended that the thermal pad area should be ...
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D.4.2. Stencil Design for Thermal Pad In order to effectively remove the heat from the package and to enhance the electrical performance, the die paddle needs to be soldered to the PCB thermal pad, preferably with minimum voids. However, eliminating ...
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Figure D-4. Solder Mask Options for Thermal Vias Via Tenting from Top All of these options have pros and cons when mounting the QFN package on the board. While via tenting from the top side may result in smaller voids, ...
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D.4.4. Stencil Thickness and Solder Paste A stencil thickness of 0.125 mm is recommended for 0.4 and 0.5 mm pitch parts. A laser-cut, stainless steel stencil is recommended with electro-polished trapezoidal walls to improve the paste release. Since not enough ...
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The fillet formation is also a function of the PCB land size, the printed solder volume, and the package standoff height. Since there is only limited solder available, higher standoff (controlled by the paste coverage on the thermal pad) may ...
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D.4.6. Reflow Profile The reflow profile and the peak temperature have a strong influence on void formation. Amkor has conducted experiments with the different reflow profiles (ramp-to-peak vs. ramp-hold-ramp), the peak reflow temperatures, and the times above liquidus using Alpha ...
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Figure D-9. Typical PCB mounting process flow. D.6. Rework Guidelines Since solder joints are not fully exposed in the case of QFNs, any retouch is limited to the side fillet. For defects underneath the package, the whole package has to ...
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... D.7. Summary Successful use of the AT88RF1354 QFN package requires careful development of the PCB and the manufacturing process. This appendix contains guidelines to assist the design and manufacturing engineers in optimizing the PC board and processes. These guidelines include: ─ ...
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... FWT .............Frame Waiting Time. Maximum time the PCD must wait for a PICC response. H ..................Magnetic field. Hg ................Mercury. Hmin ............Minimum unmodulated operating magnetic field strength. Hmax ...........Maximum unmodulated operating magnetic field strength. Host .............The microcontroller connected to the AT88RF1354 serial interface. I....................Current. IC .................Integrated Circuit. ID .................Identification. IEC...............International Electrotechnical Commission. www.iec.ch ISO ...
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... QFN .............Surface mount package style. R ..................Random number selected by PICC during anticollision. RAM .............Random Access Memory. Volatile memory. Reader .........The AT88RF1354 with antenna and associated circuitry. RF ................Radio Frequency. RFU .............Reserved for Future Use. Any feature or bit reserved by ISO or by Atmel. rms...............Root Mean Square. ...
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... Appendix F. Standards and Reference Documents International Standards AT88RF1354 is designed to comply with the applicable requirements of the following ISO/IEC standards for Type B PCDs operating at the standard 106 kbps data rate. ISO/IEC 10373-6:2001 Identification Cards – Test Methods – Part 6: Proximity Cards ISO/IEC 14443-2:2001 Identification Cards – Contactless Integrated Circuit(s) Cards – Proximity Cards – Part 2: Radio Frequency Power and Signal Interface ISO/IEC 14443-3:2001 Identification Cards – ...
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... Appendix G. Errata G.1. ATD88RF1354 with IDR Hardware Revision Register: $10 Pre-production version, not fully qualified. Does not meet the 2000 V minimum HBM ESD requirement. G.2. AT88RF1354 with IDR Hardware Revision Register: $11 No errata. 13.56 MHz Type B RF Reader 48 8547A−RFID−10/08 ...
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Revision History Table 6. Revision History Doc. Rev. 8547A 10/2008 8547A−RFID−10/08 Date Initial document release. 13.56 MHz Type B RF Reader Comments 49 ...
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