hsdl-3600 Avago Technologies, hsdl-3600 Datasheet - Page 25

• Manufacturer Part Number: hsdl-3600
• Description: Irda Compliant 4 Mb/s 3 V Infrared Transceiver - Agilent Hewlett-packard
• Manufacturer: Avago Technologies

2.1 Recommended Metal
Solder Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
Figure 4.0. Solder Paste Stencil Aperture.
3.0 Pick and Place
Misalignment Tolerance and
Product Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate, the unit will self-
align in X-direction after solder
reflow. Units should be properly
reflowed in IR Hot Air convection
oven using the recommended
reflow profile. The direction of
board travel does not matter.
l
SOLDER
PASTE
t, nominal stencil thickness
0.152
0.127
Aperture opening for shield pad is 5.7 mm x 1.6 mm as per land dimensions
mm
w, the width of aperture is fixed at 0.60 mm (0.024 inches)
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
inches
0.006
0.005
APERTURE AS PER
LAND DIMENSIONS
w
X – direction
See Fig 4.0
t (STENCIL THICKNESS)
Allowable Misalignment Tolerance
3.1
3.7
mm
l, length of aperture
0.05
0.05
25
0.2 mm (0.008 inches)
0.122
0.147
inches
0.002
0.002