amis-30523 ON Semiconductor, amis-30523 Datasheet - Page 5

• Manufacturer Part Number: amis-30523
• Description: Amis-30523 Product Preview Can Micro-stepping Motor Driver
• Manufacturer: ON Semiconductor

Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.
cooling optimizations, the QFN has an exposed thermal pad
which has to be soldered to the PCB ground plane. The
ground plane needs thermal vias to conduct the heat to the
bottom layer. Figure 4 gives an example for good power
distribution solutions.
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are:
•
•
Parameters Motor Driver.
Table 3. THERMAL RESISTANCE
The AMIS−30523 is available in a QFN−52 package. For
For precise thermal cooling calculations the major
The thermal resistances are presented in Table 5: DC
Static environmental air (via the case)
PCB board copper area (via the exposed pad)
Package
QFN−52
VDD
IN
IN
TYPE 3: V
TYPE 1: CLR Input
TYPE 2: CLK, DI, CS, NXT, DIR Inputs
Junction−to−Exposed Pad
(Rth
DD
4k
0.95
VDD
and V
Rpd
J−EP
4k
)
BB
PACKAGE THERMAL CHARACTERISTICS
Figure 3. In− and Output Equivalent Diagrams
Power Supply
VBB
EQUIVALENT SCHEMATICS
Thermal Resistance
http://onsemi.com
1S0P Board
60
Junction−to−Ambient (Rth
VBB
5
from the junction to the ambient (Rth
from the junction to exposed pad (Rth
can find the values for the Rth
according to JESD−51:
JESD−51 as follows:
•
•
•
The major thermal resistances of the device are the Rth
The Rth
A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
Board thickness is 1.46 mm (FR4 PCB material)
The 2 signal layers: 70 mm thick copper with an area of
5500 mm
J−A
2
TYPE 4: DO and ERR Open
Drain Outputs
TYPE 5: SLA Analog Output
copper and 20% conductivity
for 2S2P is simulated conform JEDEC
2S2P Board
J−A
30
)
R
out
J−A
and Rth
J−A
J−EP
) and the overall Rth
). In Table 3 one
OUT
SLA
J−EP
Unit
K/W
, simulated