stm7007 STMicroelectronics, stm7007 Datasheet - Page 9

• Manufacturer Part Number: stm7007
• Description: Single-chip Hardware Accelerated Encryption Engine For Computer And Peripherals Applications
• Manufacturer: STMicroelectronics

1.2.2
Figure 2.
Figure 3.
Recommended footprint
PCB layout recommendation
Stencil layout recommendation
GND VIA (8)
Doc ID 022239 Rev 1
Stencil thickness: 4 mils
Land aperture: 250 x 325 µm (1 to 1 ratio)
ePad soldering aperture: 750 u dia. (slight increase)
Thicker stencil option
Stencil thickness: 5 mils
Land aperture: 275 x 357 µm (10% increase)
ePad soldering aperture: 800 µm dia.
For a thicker stencil, slightly increase the aperture size
for robust solder paste release
(increase area ratio: area of pad / area of aperture wall).
PCB_Metal: 250 x 325 µm
(1 to 1 ratio to package pad)
PCB_Solder Mask Opening: 300 x 375 µm
GND Pad
PCB Metal: 3600 x 3600 µm
ePad Soldering Area (5)
PCB_Solder Mask Opening: 700 µm dia.
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