stm7007 STMicroelectronics, stm7007 Datasheet - Page 11

• Manufacturer Part Number: stm7007
• Description: Single-chip Hardware Accelerated Encryption Engine For Computer And Peripherals Applications
• Manufacturer: STMicroelectronics

STM7007
Device pinout and package
1.2.4
Recommended land pad layout and solder reflow profile
Pay special attention to the traces connecting to the metal pads on the board. Trace
cracking can occur during normal handling of the board. This trace cracking usually occurs
at the edge of the solder mask opening, around the metal pad.
To avoid this mode of failure, make the trace under the solder mask edge wider than the rest
of the trace, as shown in
Figure
5. Depending on the reliability requirements of the
connection, the wider part of the trace might need to be as wide as 50 to 75% of the metal
pad width.
Figure 5.
Wider trace connection to avoid cracking
Doc ID 022239 Rev 1
11/27