mpc8308 Freescale Semiconductor, Inc, mpc8308 Datasheet - Page 79

• Manufacturer Part Number: mpc8308
• Description: Mpc8308 Powerquicc Ii Pro Processor Hardware Specification
• Manufacturer: Freescale Semiconductor, Inc

22 Thermal
This section describes the thermal specifications of the device.
22.1
Table 59
Freescale Semiconductor
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
1
2
Notes:
0–1
For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 333 MHz.
Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
10
00
01
10
RCWL[COREPLL]
provides the package thermal characteristics for the 473, 19 × 19 mm MAPBGA.
Thermal Characteristics
Characteristic
0010
0011
0011
0011
2–5
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 1
6
1
0
0
0
Table 59. Package Thermal Characteristics for MAPBGA
Table 58. e300 Core PLL Configuration (continued)
core_clk: csb_clk Ratio
2.5:1
3:1
3:1
3:1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
Board Type
—
—
1
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
VCO Divider (VCOD)
Value
8
2
4
8
42
27
35
24
17
9
2
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Thermal
Notes
1,2,3
1,2
1,3
1,3
4
5
6
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