mpc8308 Freescale Semiconductor, Inc, mpc8308 Datasheet - Page 62

• Manufacturer Part Number: mpc8308
• Description: Mpc8308 Powerquicc Ii Pro Processor Hardware Specification
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
Figure 50
Figure 51
20 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8308 is available in
a Moulded Array Process Ball Grid Array (MAPBGA). For information on the MAPBGA, see
Section 20.1, “Package Parameters for the MPC8308 MAPBGA,”
Dimensions of the MPC8308 MAPBGA.”
20.1
The package parameters are as provided in the following list. The package type is 19 mm × 19 mm, 473
MAPBGA.
62
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Note: The clock edge is selectable on SPI.
Note: The clock edge is selectable on SPI.
Package Parameters for the MPC8308 MAPBGA
SPICLK (output)
shows the SPI timing in slave mode (external clock).
shows the SPI timing in master mode (internal clock).
Output Signals:
Output Signals:
SPICLK (input)
Input Signals:
Input Signals:
(See Note)
(See Note)
(See Note)
(See Note)
SPIMOSI
SPIMISO
SPIMISO
SPIMOSI
Figure 51. SPI AC Timing in Master Mode (Internal Clock) Diagram
Figure 50. SPI AC Timing in Slave Mode (External Clock) Diagram
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 1
t
NEIVKH
t
NIIVKH
t
NIKHOV
19 mm × 19 mm
0.80 mm
1.39 mm
96.5 Sn/ 3.5Ag
473
0.40 mm
t
NIIXKH
t
NEKHOV
t
NEIXKH
and
Section 20.2, “Mechanical
Freescale Semiconductor