mpc8360e Freescale Semiconductor, Inc, mpc8360e Datasheet - Page 102

• Manufacturer Part Number: mpc8360e
• Description: Mpc8360e Powerquicc Ii Pro Family
• Manufacturer: Freescale Semiconductor, Inc

Thermal
R
change the case to ambient thermal resistance, R
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Table 78
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
102
θ
MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
MEI, 75x85x12 mm, adjacent board, 40 mm Side bypass
shows heat sinks and junction-to-case thermal resistance for TBGA package.
MEI, 75x85x12 no adjacent board, extrusion
MEI, 75x85x12 no adjacent board, extrusion
MEI, 75x85x12 no adjacent board, extrusion
Table 78. Heat Sinks and Junction-to-Case Thermal Resistance of TBGA Package
Heat Sink Assuming Thermal Grease
Wakefield, 53x53x25 mm Pin Fin
Wakefield, 53x53x25 mm Pin Fin
Wakefield, 53x53x25 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
R
R
R
θ
θ
θ
JA
JC
CA
= junction to ambient thermal resistance (°C/W)
= junction to case thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
θ
CA
. For instance, the user can change the size of the heat
Natural Convention
Natural Convention
Natural Convention
Natural Convention
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
Junction-to-Ambient
Thermal Resistance
35x35 mm TBGA
Freescale Semiconductor
10.7
6.2
5.3
8.1
4.4
3.7
5.4
3.2
2.4
6.4
3.8
2.5
2.8