mpc8250 Freescale Semiconductor, Inc, mpc8250 Datasheet - Page 58

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mpc8250

Manufacturer Part Number
mpc8250
Description
Mpc8250 Powerquicc Ii Integrated Communications Processor
Manufacturer
Freescale Semiconductor, Inc
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Ordering Information
6
Figure 19
addition to the processor frequency, the part numbering scheme also consists of a part modifier that
indicates any enhancement(s) in the part from the original production design. Each part number also
contains a revision code that refers to the die mask revision number and is specified in the part numbering
scheme for identification purposes only. For more information, contact your local Freescale sales office.
7
Table 23
58
Revision
Product Code
Device Number
Process Technology
(A = 0.25 micron)
Temperature Range
(Blank = 0 to 105 °C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Ordering Information
Document Revision History
0
C = -40 to 105 °C)
provides a revision history for this template.
provides an example of the Freescale part numbering nomenclature for the MPC8250. In
10/2002
10/2002
11/2001 Initial version
11/2002
2/2002
3/2202
3/2002
5/2002
9/2002
Date
Addition of VR (516 PBGA) package information. Refer to sections 2.2, 4.2, and 5.
Table
Table
Table
• Note 2 for Table 4 (changes in italics): “...greater than or equal to 266 MHz, 200 MHz CPM...”
• Addition of note on page 8:VDDH and VDD tracking
MPC 8250 A C
Table
0011_000 to 0011_100 and 1011_000 to 1011_1000
Table
Table
Table
Table
Table
Table
Table
Table
21, “VR Pinout”: corrected ball assignment for the following pins—A12–A17, TA, PD5, PC2.
21, “VR Pinout”: Addition of L3 to the Core (VDDx) pin list (page 53)
21, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 53)
18: core and bus frequency values for the following ranges of MODCK_HMODCK:
19: footnotes added to pins at AE11, AF25, U5, and V4.
19: modified notes to pins AE11 and AF25.
19: added note to pins AA1 and AG4 (Therm0 and Therm1).
19: modified note to pin AF25.
2: Notes 2 and 3
14: Note 3
16: Note 1
18: Note 3
Figure 19. Freescale Part Number Key
MPC8250 Hardware Specifications, Rev. 1
Table 23. Document Revision History
ZU XXX
Substantive Changes
X
Processor Frequency
Freescale Semiconductor
Die Revision Level
(CPU/CPM/Bus)
VR = 516 PBGA
ZU = 480 TBGA
Package

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