mpc8250 Freescale Semiconductor, Inc, mpc8250 Datasheet - Page 55

• Manufacturer Part Number: mpc8250
• Description: Mpc8250 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

5
The following sections provide the package parameters and mechanical dimensions.
5.1
Package parameters are provided in
Freescale Semiconductor
1
2
3
4
THERMAL1
I/O power
Core Power
Ground
Package
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D).
Package Description
ZU
VR
Package Parameters
MPC8250
MPC8250VR
4
Devices
Table 21. MPC8250 VR Package Pinout List (continued)
37.5 x 37.5
27 x 27
Outline
(mm)
Pin Name
MPC8250 Hardware Specifications, Rev. 1
Table
Table 22. Package Parameters
22.
PBGA
TBGA
Type
Interconnects
480
516
E6, F6, H6, L5, L6, P6, T6, U6, V5,
Y5, AA6, AA8, AA10, AA11, AA14,
AA16, AA17, AB19, AB20, W21,
U21, T21, P21, N21, M22, J22,
H21, F21, F19, F17, E16, F14,
E13, E12, F10, E10, E9
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19,
D17, C17, D10, C10
A2, B1, B2, A5, C5, C18, D4, D6,
G2, L4, P1, R1, R4, AC4, AE7,
AC23, Y25, N24, J23, A23, D23,
D20, E18, A13, A16, K10, K11,
K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10,
P11, P12, P13, P14, P15, P16,
P17, R10, R11,R12, R13, R14,
R15, R16, R17, T10, T11, T12,
T13, T14, T15, T16, T17, U10,
U11, U12, U13, U14, U15, U16,
U17
Pitch
(mm)
1.27
1
Nominal Unmounted
Ball
C23
Height (mm)
Package Description
1.55
2.25
55