mpc8250 Freescale Semiconductor, Inc, mpc8250 Datasheet - Page 31

• Manufacturer Part Number: mpc8250
• Description: Mpc8250 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Figure 14
Table 19
acronyms used in
Freescale Semiconductor
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
shows the pinout list of the ZU package of the MPC8250.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Polymide Tape
Table
19.
(Oxidized for Insulation)
Copper Heat Spreader
Table 19. MPC8250 ZU Package Pinout List
Figure 14. Side View of the TBGA Package
Pin Name
MPC8250 Hardware Specifications, Rev. 1
Glob-Top Dam
Glob-Top Filled Area
View
Die
Wire Bonds
Attach
Die
Table 20
Copper Traces
Cavity
Etched
defines conventions and
Pressure Sensitive
Adhesive
Ball
W5
G1
E2
E3
H5
H2
H1
K4
K3
K2
K1
F4
J5
J4
J3
J2
J1
L5
L4
L3
L2
L1
Pinout
31