mpc8241tzq266c Freescale Semiconductor, Inc, mpc8241tzq266c Datasheet - Page 32

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mpc8241tzq266c

Manufacturer Part Number
mpc8241tzq266c
Description
Mpc8241 Integrated Processor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Package Description
5.2
Figure 24
that this is available for Rev. B parts only.
32
E2
W
M
G
Pin Assignments and Package Dimensions
V
U
T
R
P
N
L
K
H
F
E
D
C
B
A
J
shows the top surface, side profile, and pinout of the MPC8241, 357 PBGA ZP package. Note
1
2
Figure 24. MPC8241 Package Dimensions and Pinout Assignments (ZP Package)
3
4
5
BOTTOM VIEW
6
TOP VIEW
7
8
9
10
D2
D1
D
11
12
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
13
14
15
16
17
18
4X
19
E
B
0.2
357X
A
E1
18X
0.30
0.15
e
b
M
M
C
C
A B
0.35 C
0.20 C
0.25 C
A2
A3
A1
SIDE VIEW
A
C
NOTES:
1.
2.
3.
DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS THE MAXIMUM SOLDER
BALL DIAMETER MEASURED PARALLEL TO
DATUM C.
DIM
A1
A2
A3
D1
D2 22.40
E1
E2 22.40
A
b
D
E
e
MILLIMETERS
MIN
0.50
0.95
0.70
0.60
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
---
22.60
22.60
Freescale Semiconductor
MAX
2.05
0.70
1.35
0.90
0.90

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