tda8358j-n2 NXP Semiconductors, tda8358j-n2 Datasheet - Page 17
tda8358j-n2
Manufacturer Part Number
tda8358j-n2
Description
Full Bridge Vertical Deflection Output Circuit In Lvdmos With East-west Amplifier
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8358J-N2.pdf
(20 pages)
- Current page: 17 of 20
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Philips Semiconductors
PACKAGE OUTLINE
2002 Sep 25
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
Full bridge vertical deflection output circuit
in LVDMOS with east-west amplifier
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT141-6
17.0
15.5
A
1
Z
A
4.6
4.4
2
0.75
0.60
b
p
e
0.48
0.38
IEC
c
e
D
d
1
24.0
23.6
D
(1)
20.0
19.6
d
b
p
JEDEC
D
10
h
w
12.2
11.8
REFERENCES
M
E
13
(1)
0
3.4
j
e
e
1.7
scale
1
EIAJ
17
5
5.08
e
2
non-concave
E h
10 mm
E
6
h
L
B
x
L
3.4
3.1
3
j
Q
12.4
11.0
m
L
A
view B: mounting base side
2
2.4
1.6
L
3
e
c
2
PROJECTION
4.3
EUROPEAN
m
D
h
E
2.1
1.8
Q
A
v
0.8
Product specification
M
v
TDA8358J
0.25
w
ISSUE DATE
97-12-16
99-12-17
0.03
x
SOT141-6
2.00
1.45
Z
(1)
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