tda8932btw-n2 NXP Semiconductors, tda8932btw-n2 Datasheet - Page 45
tda8932btw-n2
Manufacturer Part Number
tda8932btw-n2
Description
Tda8932b Class-d Audio Amplifier
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8932BTW-N2.pdf
(48 pages)
NXP Semiconductors
18. Abbreviations
TDA8932B_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 18.
Acronym
BTL
DMOS
ESD
OCP
OTP
OVP
PWM
SE
TF
UBP
UVP
WP
Fig 42. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Bridge Tied Load
Double diffused Metal Oxide Semiconductor
ElectroStatic Discharge
OverCurrent Protection
OverTemperature Protection
OverVoltage Protection
Pulse Width Modulation
Single-Ended
Thermal Foldback
UnBalance Protection
UnderVoltage Protection
Window Protection
Rev. 03— 21 June 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
Class-D audio amplifier
peak
© NXP B.V. 21 June 2007. All rights reserved.
TDA8932B
001aac844
time
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