tda8932btw-n2 NXP Semiconductors, tda8932btw-n2 Datasheet - Page 26

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tda8932btw-n2

Manufacturer Part Number
tda8932btw-n2
Description
Tda8932b Class-d Audio Amplifier
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
TDA8932B_3
Product data sheet
14.6 Device synchronization
14.7 Thermal behavior (printed-circuit board considerations)
Where:
Example:
Substituting R1 = R2 = 4.7 k , Z
results in a gain of G
If two or more TDA8932B devices are used in one application it is recommended that all
devices are synchronized running at the same switching frequency to avoid beat tones.
Synchronization can be realized by connecting all OSCIO pins together and configure one
of the TDA8932B devices as master, while the other TDA8932B devices are configured as
slaves (see
A device is configured as master when connecting a resistor between pins OSCREF and
V
oscillator output for synchronization. The OSCREF pins of the slave devices should be
shorted to V
The TDA8932B is available in two different thermally enhanced packages:
The SO32 package has special thermal corner-leads, increasing the power capability
(reducing the overall R
and 32) should be attached to a copper plane. The SO package is very suitable for
applications with limited space for a thermal plane (in a single layer PCB design).
R
Fig 11. Master slave concept in two chip application
SSD(HW)
EQ
R
R3 = parallel resistor ( )
Z
TDA8932BT in a SO32 (SOT287-1) package for reflow and wave solder process
TDA8932BTW in an HTSSOP32 (SOT549-1) package for reflow solder process only
i
EQ
= internal input impedance ( )
=
= equivalent resistance (
----------------- -
R3
R3
setting the carrier frequency. Pin OSCIO of the master is then configured as an
+
Figure
SSD(HW)
Z
Z
i
i
100 nF
C osc
11).
configuring pin OSCIO as an input.
v(tot)
master
OSCREF V
th(j-a)
Rev. 03— 21 June 2007
= 26.3 dB.
R osc
39 k
. To benefit from the corner leads pins V
TDA8932B
SSD(HW)
IC1
i
= 100 k and R3 = 22 k in
OSCIO
slave
OSCIO
TDA8932B
V
SSD(HW)
IC2
Equation 8
Class-D audio amplifier
OSCREF
© NXP B.V. 21 June 2007. All rights reserved.
SSD(HW)
TDA8932B
001aaf600
and
(pins 1, 16, 17
Equation 9
26 of 48
(9)

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