tda8755t NXP Semiconductors, tda8755t Datasheet - Page 17

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tda8755t

Manufacturer Part Number
tda8755t
Description
Yuv 8-bit Video Low-power Analog-to-digital Interface
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINE
1995 Mar 09
SO32: plastic small outline package; 32 leads; body width 7.5 mm
handbook, full pagewidth
YUV 8-bit video low-power
analog-to-digital interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
Note
UNIT
mm
VERSION
OUTLINE
SOT287-1
32
1
Z
max.
y
2.65
0.10
A
0.012
0.004
0.3
0.1
pin 1 index
A
1
0.096
0.086
e
2.45
2.25
A
2
IEC
0.25
0.01
A
3
0.49
0.36
0.02
0.01
b
D
p
0.011
0.007
0.27
0.18
JEDEC
c
REFERENCES
20.7
20.3
0.81
0.80
D
0
(1)
0.30
0.29
E
7.6
7.4
(1)
scale
0.050
EIAJ
1.27
17
5
e
b
p
16
17
10.65
10.00
0.42
0.39
H
E
w
c
M
0.055
10 mm
1.4
L
A
0.043
0.016
2
1.1
0.4
L
p
A
1
0.047
0.039
1.2
1.0
Q
H
E
PROJECTION
E
EUROPEAN
0.25
0.01
detail X
v
L
0.25
0.01
L
w
p
Q
Product specification
(A )
0.004
0.1
A
3
y
TDA8755
ISSUE DATE
92-11-17
95-01-25
0.037
0.022
0.95
0.55
X
Z
A
v
(1)
SOT287-1
M
A
8
0
o
o

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