tda8757c NXP Semiconductors, tda8757c Datasheet - Page 33

• Manufacturer Part Number: tda8757c
• Description: Tda8757c Triple 8-bit Adc 205 Msps
• Manufacturer: NXP Semiconductors

Philips Semiconductors
14. Package outline
Fig 19. Package outline.
9397 750 10111
Preliminary data
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT612-1
E h
max.
1.6
A
109
144
108
0.15
0.05
A 1
1
y
1.45
1.35
A 2
e
pin 1 index
exposed die pad
0.25
A 3
IEC
0.27
0.17
b p
b p
D h
H
D
D
0.20
0.09
c
w
M
20.1
19.9
D
MS-026
JEDEC
(1)
Z D
X
D h
7.1
6.9
REFERENCES
Rev. 01 — 14 August 2002
20.1
19.9
36
E
73
(1)
72
37
Z E
E h
7.1
6.9
0
B
JEITA
b
e
p
w
v
M
0.5
M
v
e
M
scale
B
5
A
E
22.15
21.85
A
H D
H
E
22.15
21.85
10 mm
H E
A
A
L
1
2
A
0.75
0.45
L p
1
PROJECTION
0.2
EUROPEAN
v
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
detail X
0.08
Triple 8-bit ADC 205 Msps
w
0.08
TDA8757C
y
L
Z D
L
1.4
1.1
ISSUE DATE
p
(1)
02-01-25
02-04-24
Z E
(A )
1.4
1.1
3
(1)
SOT612-1
7
0
o
o
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