mt47h256m8thn-3 Micron Semiconductor Products, mt47h256m8thn-3 Datasheet - Page 11

• Manufacturer Part Number: mt47h256m8thn-3
• Description: 2gb X4, X8 Twindie Ddr2 Sdram Functionality
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 5:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef8266acfe/Source: 09005aef8266ac6e
MT47H512M4_32M_16M_twindie.fm - Rev. B 1/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respec-
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
Seating plane
Dimensions apply
to solder balls
post-reflow. The
pre-reflow diameter
is Ø0.42 on a Ø0.33
NSMD ball pad.
8.00
0.10 A
63X ∅0.45
63-Ball FBGA Package Dimensions
Ball A9
4.00
Notes:
A
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1. All dimensions are in millimeters.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.20
9.00 ±0.10
0.80 TYP
6.40
C L
4.50 ±0.05
C L
5.75 ±0.05
tive owners.
0.80 TYP
1.00 ±0.05
Ball A1
Ball A1 ID
11
11.50 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.35 MAX
2Gb: x4, x8 TwinDie DDR2 SDRAM
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID