bsv-1.5s12r0h XP Power Limited, bsv-1.5s12r0h Datasheet - Page 21

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bsv-1.5s12r0h

Manufacturer Part Number
bsv-1.5s12r0h
Description
Pol Dc-dc Converter
Manufacturer
XP Power Limited
Datasheet
11. Soldering Conditions
Please conduct by the condition as below regarding the soldering temperature and time and storage before mounting.
11-1. Reflow method
Pre-heating temp.: 150-180°C, within 60 sec max. (Refer to the figure below)
Peak heading temp.: 250°C max.
Reflow: twice
Note 1. Do not give shock at reflow because components which compose the converter may move.
Note 2. After mounting the converter on PCB, please do not reflow again turning the PCB over.
Note 3. This converter cannot be soldered by flow.
11-2. About storage before being mounted
When you open dry packing, storage conditions before being mounted should be 30°C/60% RH or below. Moreover, baking
(125°C±5°C, 12H) is needed before the reflow when it is one year while dry packed and dry packing is opened with 30°C/60%
RH above 168 hours.
After mounting, it depends on the environmental condition.
12. Vibration and shock test
Vibration : 5~10 Hz All amplitudes 10mm, 10~55Hz Acceleration 2G (Three direction, for one hour each)
Shock : Acceleration 20G (Three direction, three times each)
Shocking time 11±5ms
DC-DC Converter
2.3℃/sec. max.
Temp. regulation point is the
component surface temp.
The Fifth Generation, Ultra Small Size, Isolated DC-DC Converter
220°C or more, within 60 sec max.
180℃
150℃
60sec. max.
2℃/sec. max.
60sec. max.
Peak:250℃ max.
220℃
1 to 4℃/sec.
Time
BSV-H22A Series
BDD20080618
10

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