DIM200MKS12-A000 Dynex Semiconductor, DIM200MKS12-A000 Datasheet - Page 3

• Manufacturer Part Number: DIM200MKS12-A000
• Description: Igbt Modules - Chopper
• Manufacturer: Dynex Semiconductor

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THERMAL AND MECHANICAL RATINGS
Internal insulation:
Baseplate material:
Creepage distance:
Clearance:
CTI (Critical Tracking Index): 175
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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Symbol
R
R
R
T
th(c-h)
th(j-c)
th(j-c)
T
-
stg
j
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
(Antiparallel and freewheel diode)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
Al
Cu
22mm
12mm
Parameter
2
O
3
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
Mounting - M6
Electrical connections - M4
Test Conditions
-
DIM200MKS12-A000
Min.
–40
-
-
-
-
-
-
-
Typ.
-
-
-
-
-
-
-
-
Max.
194
150
125
125
87
15
5
2
˚C/kW
˚C/kW
˚C/kW
Units
Nm
Nm
˚C
˚C
˚C
3/10