EM6517 ETC, EM6517 Datasheet - Page 65

• Manufacturer Part Number: EM6517
• Description: 4 BIT MICROCONTROLLER
• Manufacturer: ETC

24 Ordering Information
The EM6517 should be used for engineering purposes only. No volume production must be planned.
24.1 Packaged devices
EM6517 VVV N C
VVV : Version (Version number given by EM Microelectronic Marin SA)
N
C
This gives below Ordering Information:
Customer package marking:
Please specify below the desired marking. (Rom Version only)
24.2 DIE Form
DIE FORM for ROM Version only.
EM6517 VVV DF TH B
VVV : Version (Version number given by EM Microelectronic Marin SA)
DF : Die Form ,
TH : Thickness,
B
This gives below Ordering Information:
Please contact EM headquarters or your local EM office for any other detail. Also refer to page 51 for additional
ordering information.
E
E
M
: Bumps,
: Package type,
: Delivery Form
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than
circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves
the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure
that the information given has not been superseded by a more up-to-date version.
M
M
F
6
P
6
5
A24
B24
A
B
WA
SW
WP
ST
08
11
15
21
27
A
B
1
5
FOR ENGINEERING ONLY
7
=
=
=
=
6 digits are available for the TSSOP Packages
11 digits are available for the PDIP and SOP Packages
=
=
=
=
=
=
=
=
=
=
=
V
1
PDIP
SOP
Stick (MFP Version)
EIA Real
Wafer
Sawn Wafer/Frame
Waffle Pack
Sticky Tape
8 mils (203um)
11 mils (280um), standard
15 mils (380um)
21 mils (533um)
27 mils (686um), not backlapped
Without Bumps
With Bumps
E
7
V
24 Pin
24 Pin
V
R
V
V
S
A28
B28
V
I
W
=
=
V
P
O
PDIP
SOP
© EM Microelectronic-Marin SA, 09/99, Rev. A/277
N
28 Pin
28 Pin (MFP Version)
1
B28
EM6517
1
A
65
A