BULD25 Power Innovations Limited, BULD25 Datasheet - Page 10

• Manufacturer Part Number: BULD25
• Description: NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
• Manufacturer: Power Innovations Limited

BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
JULY 1994 - REVISED SEPTEMBER 1997
SL003
3-pin plastic single-in-line package
NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.
P R O D U C T
10
SL003
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
Index
Dot
1,854 (0.073) MAX
0,711 (0.028)
0,559 (0.022)
3 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
1
I N F O R M A T I O N
10,2 (0.400) MAX
2
3
MECHANICAL DATA
2,54 (0.100) T.P.
(see Note A)
Pin Spacing
2 Places
4,267 (0.168)
8,31 (0.327)
MIN
MAX
12,9 (0.492)
MAX
0,356 (0.014)
0,203 (0.008)
3 Places
4,57 (0.180)
6,60 (0.260)
6,10 (0.240)
MAX
MDXXAD