SSTUA32864 Philips Semiconductors, SSTUA32864 Datasheet - Page 2

• Manufacturer Part Number: SSTUA32864
• Description: configurable registered buffer
• Manufacturer: Philips Semiconductors

Philips Semiconductors
2. Features
3. Applications
4. Ordering information
Table 1:
T
9397 750 14757
Product data sheet
Type number
SSTUA32864EC/G Pb-free (SnAgCu
SSTUA32864EC
amb
= 0 C to +70 C.
Ordering information
Solder process
solder ball compound)
SnPb solder ball
compound
Configurable register supporting DDR2 Registered DIMM applications
Configurable to 25-bit 1 : 1 mode or 14-bit 1 : 2 mode
Controlled output impedance drivers enable optimal signal integrity and speed
Exceeds SSTUA32864 JEDEC specification speed performance (1.8 ns max.
single-bit switching propagation delay; 2.0 ns max. mass-switching)
Supports up to 450 MHz clock frequency of operation
Optimized pinout for high-density DDR2 module design
Chip-selects minimize power consumption by gating data outputs from changing state
Supports SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation (1.7 V to 2.0 V)
Available in 96-ball, 13.5
400 MT/s to 667 MT/s DDR2 registered DIMMs without parity
1.8 V configurable registered buffer for DDR2-667 RDIMM applications
Package
Name
LFBGA96
LFBGA96
Rev. 01 — 12 May 2005
5.5 mm, 0.8 mm ball pitch LFBGA package
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUA32864
Version
SOT536-1
SOT536-1
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