MT58L64L36D Micron Semiconductor, MT58L64L36D Datasheet - Page 11
MT58L64L36D
Manufacturer Part Number
MT58L64L36D
Description
(MT58LxxxLxxD) 2Mb SRAM
Manufacturer
Micron Semiconductor
Datasheet
1.MT58L64L36D.pdf
(19 pages)
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NOT RECOMENDED FOR NEW DESIGNS
TQFP THERMAL RESISTANCE
NOTE: 1. This parameter is sampled.
2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L128L18D_C.p65 – Rev. C, Pub. 11/02
DESCRIPTION
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Top of Case)
Test conditions follow standard test methods
and procedures for measuring thermal
impedance, per EIA/JESD51.
CONDITIONS
11
PIPELINED, DCD SYNCBURST SRAM
2Mb: 128K x 18, 64K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
θ
θ
JA
JC
TYP
40
8
UNITS NOTES
©2002, Micron Technology, Inc.
°C/W
°C/W
1
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