LFECP40 Lattice Semiconductor, LFECP40 Datasheet - Page 35

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LFECP40

Manufacturer Part Number
LFECP40
Description
(LFEC Series) LatticeECP/EC Family Data Sheet
Manufacturer
Lattice Semiconductor
Datasheet
Architecture
Lattice Semiconductor
LatticeECP/EC Family Data Sheet
Configuration and Testing
The following section describes the configuration and testing features of the LatticeECP/EC family of devices.
IEEE 1149.1-Compliant Boundary Scan Testability
All LatticeECP/EC devices have boundary scan cells that are accessed through an IEEE 1149.1 compliant test
access port (TAP). This allows functional testing of the circuit board, on which the device is mounted, through a
serial scan path that can access all critical logic nodes. Internal registers are linked internally, allowing test data to
be shifted in and loaded directly onto test nodes, or test data to be captured and shifted out for verification. The test
access port consists of dedicated I/Os: TDI, TDO, TCK and TMS. The test access port has its own supply voltage
V
and can operate with LVCMOS3.3, 2.5, 1.8, 1.5 and 1.2 standards.
CCJ
For more details on boundary scan test, please see information regarding additional technical documentation at
the end of this data sheet.
Device Configuration
All LatticeECP/EC devices contain two possible ports that can be used for device configuration. The test access
port (TAP), which supports bit-wide configuration, and the sysCONFIG port that supports both byte-wide and serial
configuration.
The TAP supports both the IEEE Std. 1149.1 Boundary Scan specification and the IEEE Std. 1532 In-System Con-
figuration specification. The sysCONFIG port is a 20-pin interface with six of the I/Os used as dedicated pins and
the rest being dual-use pins. When sysCONFIG mode is not used, these dual-use pins are available for general
purpose I/O. There are four configuration options for LatticeECP/EC devices:
1. Industry standard SPI memories.
2. Industry standard byte wide flash and ispMACH 4000 for control/addressing.
3. Configuration from system microprocessor via the configuration bus or TAP.
4. Industry standard FPGA board memory.
On power-up, the FPGA SRAM is ready to be configured with the sysCONFIG port active. The IEEE 1149.1 serial
mode can be activated any time after power-up by sending the appropriate command through the TAP port. Once a
configuration port is selected, that port is locked and another configuration port cannot be activated until the next
power-up sequence.
For more information on device configuration, please see details of additional technical documentation at the end
of this data sheet.
Internal Logic Analyzer Capability (ispTRACY)
All LatticeECP/EC devices support an internal logic analyzer diagnostic feature. The diagnostic features provide
capabilities similar to an external logic analyzer, such as programmable event and trigger condition and deep trace
memory. This feature is enabled by Lattice’s ispTRACY. The ispTRACY utility is added into the user design at com-
pile time.
For more information on ispTRACY, please see information regarding additional technical documentation at the
end of this data sheet.
External Resistor
LatticeECP/EC devices require a single external, 10K ohm +/- 1% value between the XRES pin and ground.
Device configuration will not be completed if this resistor is missing. There is no boundary scan register on the
external resistor pad.
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