ADSP-21060 Analog Devices, ADSP-21060 Datasheet - Page 42

• Manufacturer Part Number: ADSP-21060
• Description: ADSP-2106x SHARC DSP Microcomputer Family
• Manufacturer: Analog Devices

ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21060KS and ADSP-21060LKS are packaged in a
240-lead thermally enhanced MQFP. The top surface of the
package contains a copper slug from which most of the die heat
is dissipated. The slug is flush with the top surface of the pack-
age. Note that the copper slug is internally connected to GND
through the device substrate. The ADSP-21060KB and ADSP-
21060LKB are plastic ball grid arrays. The θ
package is 1.7°C/Q.
The ADSP-2106x is specified for a case temperature (T
To ensure that the T
ceeded, a heatsink and/or an air flow source may be used. A
heatsink should be attached with a thermal adhesive.
ADSP-21060/ADSP-21060L
9
8
7
6
5
4
3
2
1
0
0
20
40
T
CASE =
CASE
RISE TIME
60
LOAD CAPACITANCE – pF
data sheet specification is not ex-
Y = 0.0391X + 0.36
T
AMB
80
FALL TIME
100
+ (PD × θ
120
Y = 0.0305X + 0.24
140
CA
JC
)
160
for the PBGA
180
200
CASE
).
T
PD =
θ
Airflow
(Linear Ft./Min.)
θ
NOTES
This represents thermal resistance at total power of 5 W.
With air flow, no variance is seen in θ
θ
Airflow
(Linear Ft./Min.)
θ
NOTE
With air flow, no variance is seen in θ
CA
CA,
JC
CA
JC
CA
CASE
at 0 LFM varies with power: at 2W, θ
= 0.3 C/W
= 1.7 C/W
(°C/W)
(°C/W)
θ
NOMINAL
CA
=
= Values from table below.
–1
5
4
3
2
1
specific application; a method for calculating PD is
shown under Power Dissipation).
Case temperature (measured on top surface of package)
Power dissipation in W (this value depends upon the
25
Plastic Quad Flatpack Package
50
0
10
PBGA Package
75
LOAD CAPACITANCE – pF
0
20.7
CA
CA
100
100
9
with power.
with power.
CA
Y = 0.0329X –1.65
= 14°C/W, at 3W θ
125
200
8
200
15.3
150
400
7
175
CA
= 11°C/W.
400
12.9
200
600
6