MAX106CHC Maxim, MAX106CHC Datasheet - Page 25

• Manufacturer Part Number: MAX106CHC
• Description: 5V / 600Msps / 8-Bit ADC with On-Chip 2.2GHz Bandwidth Track/Hold Amplifier
• Manufacturer: Maxim

Table 7. Thermal Performance for
MAX106 With or Without Heatsink
The MAX106 has been modeled to determine the thermal
resistance from junction to ambient. Table 7 lists the
ADC’s thermal performance:
Ambient Temperature:
Heatsink Dimensions:
PC Board Size and Layout:
Aavid Engineering and IERC provide open-tooled, low-
profile heatsinks, fitting the 25mm x 25mm ESBGA
package.
Aavid Engineering, Inc.
Phone: [phone]
Heatsink Catalog No.: 335224B00032
Heatsink Dimensions: 25mm x 25mm x 10mm
International Electronic Research Corporation (IERC)
Phone: [phone]
Heatsink Catalog No.: BDN09-3CB/A01
Heatsink Dimensions: 23.1mm x 23.1mm x 9mm
Grounding and power-supply decoupling strongly influ-
ence the MAX106’s performance. At 600MHz clock fre-
quency and 8-bit resolution, unwanted digital crosstalk
may couple through the input, reference, power-supply,
and ground connections and adversely influence the
dynamic performance of the ADC. Therefore, closely
follow the grounding and power-supply decoupling
guidelines (Figure 22).
Maxim strongly recommends using a multilayer printed
circuit board (PCB) with separate ground and power-
supply planes. Since the MAX106 has separate analog
(linear ft/min)
AIRFLOW
200
400
800
0
Bypassing/Layout/Power Supply
______________________________________________________________________________________
2.2GHz Bandwidth Track/Hold Amplifier
HEATSINK
WITHOUT
±5V, 600Msps, 8-Bit ADC with On-Chip
16.5
14.3
12.5
13
MAX106
4in. x 4in.
Heatsink Manufacturers
T
25mm x 25mm x 10mm
2 Signal Layers
2 Power Layers
A
Thermal Performance
= +70°C
JA
WITH HEATSINK
(°C/W)
12.5
9.4
8.3
7.4
and digital ground connections (GNDA, GNDI, GNDR,
and GNDD, respectively), the PCB should feature sep-
arate analog and digital ground sections connected at
only one point (star ground at the power supply). Digital
signals should run above the digital ground plane, and
analog signals should run above the analog ground
plane. Keep digital signals far away from the sensitive
analog inputs, reference inputs, and clock inputs. High-
speed signals, including clocks, analog inputs, and
digital outputs, should be routed on 50Ω microstrip
lines such as those employed on the MAX106 evalua-
tion kit.
The MAX106 has separate analog and digital power-
supply inputs: V
and V
bution, bandgap reference, and reference amplifier;
V
V
based circuit sections; and V
logic circuits of the data converter.
The MAX106 V
open while the part is being powered up. To avoid this
condition, add a high-speed Schottky diode (such as a
Motorola 1N5817) between V
prevents the device substrate from forward biasing,
which could cause latchup.
Figure 21. MAX106 Thermal Performance
CC
CC
O (+3V to V
A (+5V) to supply the ADC’s comparator array;
CC
I (+5V) to power the T/H amplifier, clock distri-
18
16
14
12
10
8
6
0
THERMAL RESISTANCE vs. AIRFLOW
100
EE
CC
EE
D) to establish power for all PECL-
supply contacts must not be left
200
(-5V analog and substrate supply)
AIRFLOW (linear ft./min.)
300 400 500 600 700 800
WITHOUT HEATSINK
WITH HEATSINK
EE
CC
and GNDI. This diode
D (+5V) to supply all
25