USBLC6-2 STMicroelectronics, USBLC6-2 Datasheet - Page 11

• Manufacturer Part Number: USBLC6-2
• Description: VERY LOW CAPACITANCE ESD PROTECTION
• Manufacturer: STMicroelectronics

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USBLC6-2
4
Package information
●
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 3.
Figure 20. SOT-666 footprint
Epoxy meets UL94, V0
L1
L3
b
0.99
e
b1
D
SOT-666 dimensions
0.50
A
0.30
0.62
E1
E
2.60
L2
A3
Figure 21. SOT-666 marking
Ref.
A3
b1
E1
L1
L2
L3
D
A
E
b
e
Min.
0.45
0.08
0.17
0.19
1.50
1.50
1.10
0.10
x x x
z
Millimeters
y w w
Typ.
0.27
0.50
0.19
0.10
e3
Dimensions
Max.
0.60 0.018
0.18 0.003
0.34 0.007
0.34 0.007 0.011 0.013
1.70 0.059
1.70 0.059
1.30 0.043
0.30 0.004
Package information
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Min.
Inches
0.020
0.007
0.004
Typ.
®
0.024
0.007
0.013
0.067
0.067
0.051
0.012
Max.
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