STG4260 ST Microelectronics, Inc., STG4260 Datasheet - Page 14

• Manufacturer Part Number: STG4260
• Manufacturer: ST Microelectronics, Inc.

Package mechanical data
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Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 13. Flip-chip 12 mechanical outline
8098886_F
STG4260
®