OM6213 NXP Semiconductors, OM6213 Datasheet - Page 31

• Manufacturer Part Number: OM6213
• Description: Om6213 48 X 84 Pixels Matrix Lcd Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
21 CHIP INFORMATION
The OM6213 is manufactured in n-well CMOS technology.
22 BONDING PAD INFORMATION
Table 19 Bonding pad information
2001 Nov 07
handbook, halfpage
Pad pitch
Pad size, aluminium
CBB opening
Bump dimensions
Wafer thickness (excluding bumps)
48
1.78
mm
84 pixels matrix LCD driver
y
NAME
Fig.20 Bonding pads.
x
OM6213
9.11 mm
pitch
60 m (min.)
50
26
40
381 m ( 25)
MGT854
90 m (min.)
66 m (min.)
80
17.5 m ( 5) (min.)
ROW/COL SIDE
31
handbook, halfpage
Fig.21 Shape of alignment mark (100 m
diameter).
y
center
70 m (min.)
60
36
50
100 m (min.)
76 m (min.)
90
x
center
INTERFACE SIDE
17.5 m ( 5) (min.)
MGT855
Product specification
100
m
OM6213