OM6211 NXP Semiconductors, OM6211 Datasheet - Page 35

• Manufacturer Part Number: OM6211
• Description: 48 X 84 Dot Matrix Lcd Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
19 BONDING PAD LOCATIONS
Table 15 Bonding pad information
2002 Jan 17
handbook, halfpage
Pad pitch
Pad size (aluminium)
CBB opening
Bump dimensions
Wafer thickness (excluding bumps)
48
1.91
mm
84 dot matrix LCD driver
Fig.25 Chip size and pad pitch.
x
PAD
y
OM6211
9.46 mm
pitch
minimum 60
50
26
40
381 ( 25)
ROWS AND COLS SIDE
90
66
80
MGU292
17.5 ( 5)
35
handbook, halfpage
minimum 70
60
36
50
y
Fig.26 Shape of alignment mark.
center
INTERFACE SIDE
100
76
90
17.5 ( 5)
x
center
MGT855
Product specification
100
m
m
m
m
m
m
OM6211
UNIT