BLS3135-50 NXP Semiconductors, BLS3135-50 Datasheet - Page 3

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BLS3135-50

Manufacturer Part Number
BLS3135-50
Description
Bls3135-50 Microwave Power Transistor
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
Note
1. Equivalent thermal impedance under pulsed microwave operating conditions. Measured with IR-scan with 20 m
CHARACTERISTICS
T
APPLICATION INFORMATION
RF performance at T
2003 Apr 15
V
V
V
I
P
T
T
T
Z
V
V
I
I
I
h
Class-C; t
CM
j
CBO
CES
EBO
SYMBOL
SYMBOL
SYMBOL
FE
stg
j
sld
th j-h
CBO
CES
EBO
tot
(BR)CBO
(BR)CES
= 25 C unless otherwise specified.
Microwave power transistor
MODE OF OPERATION
spot size at hotspot.
p
= 100 s;
collector-base voltage
collector-emitter voltage
emitter-base voltage
peak collector current
total power dissipation
storage temperature
operating junction temperature
soldering temperature
thermal impedance from junction to heatsink
collector-base breakdown voltage
collector-emitter breakdown voltage I
collector leakage current
collector leakage current
emitter leakage current
DC current gain
h
= 25 C in a common-base test circuit.
= 10%
PARAMETER
PARAMETER
PARAMETER
3.1 to 3.5
(GHz)
f
open emitter
R
open collector
t
t
up to 0.2 mm from ceramic cap;
t
I
V
V
V
V
p
p
C
C
CB
CE
EB
CB
BE
= 100 s;
= 15 mA; open emitter
= 15 mA; V
10 s
100 s;
= 40 V; I
= 40 V; V
= 1.5 V; I
= 5 V; I
= 0
V
(V)
40
CE
3
C
CONDITIONS
CONDITIONS
E
C
= 1.5 A
BE
BE
= 10%; T
= 0
= 0
10%
= 0
= 0
t
t
p
p
= 100 s; = 10%; note 1
= 300 s; = 10%; note 1
typ. 55
(W)
P
mb
50
L
CONDITIONS
= 25 C
typ. 8
(dB)
G
75
75
40
7
65
p
MIN.
MIN.
BLS3135-50
Product specification
75
75
2
6
80
+200
200
235
1.5
3
0.3
VALUE
MAX.
MAX.
0.71
0.99
typ. 40
(%)
35
C
V
V
V
A
W
V
V
mA
mA
mA
C
C
C
UNIT
UNIT
UNIT
K/W
K/W

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