DSPIC30F3011 Microchip Technology Inc., DSPIC30F3011 Datasheet - Page 207
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DSPIC30F3011
Manufacturer Part Number
DSPIC30F3011
Description
Dspic30f3010/3011 Enhanced Flash 16-bit Digital Signal Controller
Manufacturer
Microchip Technology Inc.
Datasheet
1.DSPIC30F3011.pdf
(220 pages)
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44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
]
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
Confidential
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
0.80
0.00
6.30
6.30
0.25
0.30
0.20
dsPIC30F3010/3011
MIN
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
–
Microchip Technology Drawing C04-103B
D2
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
DS70141D-page 205
K
e
b