DSPIC30F2012 Microchip Technology Inc., DSPIC30F2012 Datasheet - Page 187

• Manufacturer Part Number: DSPIC30F2012
• Description: Dspic30f2011/2012/3012/3013 High-performance Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
E1
E
eB
Dimension Limits
2
1
§
D
c
dsPIC30F2011/2012/3012/3013
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
18
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
18
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
10
10
DS70139E-page 185
MAX
A2
L
22.99
10.92
3.68
8.26
6.60
3.43
0.38
1.78
0.56
4.32
15
15