BGB101 NXP Semiconductors, BGB101 Datasheet - Page 8
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BGB101
Manufacturer Part Number
BGB101
Description
0 Dbm Bluetooth Radio Module
Manufacturer
NXP Semiconductors
Datasheet
1.BGB101.pdf
(17 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BGB101
Manufacturer:
PHILIPS
Quantity:
3 429
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
SPURIOUS EMISSIONS
The conducted and radiated out-of-band spurious emissions in all operating modes are fully compliant with the
Regulatory Requirement FCC Part 15.247,C and ETS300328 (subclause 5.2.4.).
ESD PRECAUTIONS
Inputs and outputs are protected against electrostatic discharge (ESD) during handling and mounting. A human-body
model (HBM) and a machine model (MM) are used for ESD susceptibility testing. All pins withstands the following
threshold voltages:
2003 Aug 05
V
P
T
T
R
ESD threshold voltage
GND
stg
j
SYMBOL
S1
i max
0 dBm Bluetooth radio module
th j-a
SYMBOL
, V
S2
PARAMETER
, V
S3
thermal resistance from junction to ambient
supply voltage
input control pin voltage
difference in ground supply
voltage between ground pins
maximum input power
storage temperature
junction temperature
PARAMETER
HBM (JESD22-A114-B)
MM (JESD22-A115-A)
METHOD
PARAMETER
CONDITIONS
8
VALUE
3500 V
300 V
0.3
0.3
40
MIN.
3.6
V
0.01
+4
+85
150
VALUE
Preliminary specification
S
MAX.
30
CLASS
BGB101
2
2
V
V
V
dBm
C
C
UNIT
UNIT
K/W