VMMK-2503 Avago Technologies, VMMK-2503 Datasheet - Page 2

• Manufacturer Part Number: VMMK-2503
• Description: E-phemt Amplifer In A Wafer Scale Package
• Manufacturer: Avago Technologies

Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
3. Recommended attachment is solder paste. Please
4. Apply solder paste using either a stencil printer or
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
Figure 2. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
For product information and a complete list of distributors, please go to our web site:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved.
AV02-1254EN - May 12, 2008
from topside if using a vacuum collet.
see Figure 8 for recommended solder reflow profile.
Conductive epoxy is not recommended. Hand soldering
is not recommended.
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade
RF performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp to avoid damage
due to thermal shock.
temperature of 260ºC for 20 to 40 sec. Verify that the
profile will not expose device beyond these limits.
Allow the module to dry before testing.
300
250
200
150
100
50
0
0
Ramp 1 Preheat Ramp 2 Reflow
50
100
Peak = 250 ± 5 °C
SECONDS
150
Melting point = 218 °C
200
Cooling
250
300
www.avagotech.com
Outline Drawing
Top and Side View
Bottom View
Notes:
1. • indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
Notes:
1. 0.010” Rogers RO4350
0.5mm
.022 [0.559]
0.2mm
0.3mm
.014 [0.356]
0.7mm
0.8mm
BYYY
1.05mm
.008 [0.203]
.010 [0.254]
.005 [0.127]
.014 [0.356]
.020 [0.508]