VMMK-2503 Avago Technologies, VMMK-2503 Datasheet

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VMMK-2503

Manufacturer Part Number
VMMK-2503
Description
E-phemt Amplifer In A Wafer Scale Package
Manufacturer
Avago Technologies
Datasheet

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VMMK-2503
E-pHEMT Amplifier in a Wafer Scale Package
(1 - 12GHz)
Product Brief
Description
Avago Technologies has combined its industry leading E-
pHEMT technology with a revolutionary chip scale pack-
age. The GaAsCap wafer scale sub-miniature leadless pack-
age is small and ultra thin yet can be handled and placed
with standard 0402 pick and place assembly. This product
is easy to use since it requires only positive DC voltages for
bias and no matching coefficients are required for imped-
ance matching to 50 Ω systems.
Applications
• 2.4 GHz, 3.5GHz, 5-6GHz WLAN and WiMax notebook
• 802.16 & 802.20 BWA systems
• Military Radar, radio and ECM systems
GaAsCap 0402, 1.0mm x 0.5mm x 0.25mm
Pin Connections (Top View)
computer,
applications
RFin
GB1
access
point
and
mobile
Vdd
RFout
wireless
Features
• Sub-miniature 0402 (1mm x 0.5mm) Surface Mount
• Low height (0.25mm)
• Frequency Range 1 to 12 GHz
• Enhancement Mode
Specifications (5.0V, 60mA Typ. @ 6 GHz)
• 14 dB available gain
• 3.7 dB Noise Figure
• 28 dBm output 3rd order intercept
• 17 dBm output power
VMMK-2503 Product DC and RF Specifications
Figure 1. Gain, NF, Bypass & OIP3 vs. Frequency
Symbol
Vdd
Idd
Ga
NF
S11
S22
P-1dB
OIP3
Leadless Package
35
30
25
20
15
10
5
0
0
Parameters/Condition
Frequency
Supply Voltage
Supply Current
Associated Gain
Noise Figure
Input Return Loss
Output Return Loss
(Pin = 0dBm)
Output 3rd Order IP
Gain
OIP3
NF
2
4
Frequency (GHz)
6
Unit
GHz
V
mA
dB
dB
dB
dB
dBm
dBm
8
10
Typ.
1-12
5
60
14
3.7
-10
-10
+17
+28
12

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VMMK-2503 Summary of contents

Page 1

... Frequency Range GHz • Enhancement Mode Specifications (5.0V, 60mA Typ GHz) • available gain • 3.7 dB Noise Figure • 28 dBm output 3rd order intercept mobile wireless • 17 dBm output power VMMK-2503 Product DC and RF Specifications Symbol Vdd Idd Ga NF S11 S22 Vdd ...

Page 2

... Recommended SMT Attachment The VMMK Packaged Devices are compatible with high volume surface mount PCB assembly processes. Manual Assembly for Prototypes 1. Follow ESD precautions while handling packages. 2. Handling should be along the edges with tweezers or from topside if using a vacuum collet. 3. Recommended attachment is solder paste. Please see Figure 8 for recommended solder reflow profile ...

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