NX2301P NXP Semiconductors, NX2301P Datasheet - Page 12

• Manufacturer Part Number: NX2301P
• Description: P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
NX2301P
Product data sheet
Fig 19. Reflow soldering footprint SOT23 (TO-236AB)
Fig 20. Wave soldering footprint SOT23 (TO-236AB)
4.6
3
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 October 2010
(2×)
1.2
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
(3×)
0.6
20 V, 2 A P-channel Trench MOSFET
2
preferred transport direction during soldering
Dimensions in mm
Dimensions in mm
NX2301P
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
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