LPC1113FHN33 NXP Semiconductors, LPC1113FHN33 Datasheet - Page 4

• Manufacturer Part Number: LPC1113FHN33
• Description: The LPC1113FHN33 is an ARM Cortex-M0 microcontroller and it can operate up to 50 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 1.
Table 2.
LPC111X
Product data sheet
Type number
LPC1113FHN33/302
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
LPC1114FHI33/302
LPC1113FBD48/301
LPC1113FBD48/302
LPC1114FBD48/301
Type number
LPC1111FHN33/103
LPC1111FHN33/203
LPC1112FHN33/103
LPC1112FHN33/203
LPC1112FHI33/203
LPC1113FBD48/303
LPC1113FHN33/203
LPC1113FHN33/303
LPC1114FBD48/303
LPC1114FHN33/203
LPC1114FHN33/303
LPC1114FBD48/302
Ordering information (LPC1100 and LPC1100L series)
Ordering information (LPC1100XL series)
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
HVQFN33
HVQFN33
LQFP48
HVQFN33
HVQFN33
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 1 March 2012
LPC1110/11/12/13/14/15
…continued
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2012. All rights reserved.
Version
n/a
n/a
n/a
n/a
n/a
n/a
SOT313-2
SOT313-2
SOT313-2
SOT313-2
Version
n/a
n/a
n/a
n/a
n/a
SOT313-2
n/a
n/a
SOT313-2
n/a
n/a
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