PESD1LIN NXP Semiconductors, PESD1LIN Datasheet - Page 5

PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients

PESD1LIN

Manufacturer Part Number
PESD1LIN
Description
PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
PESD1LIN
Product data sheet
Fig 5.
GND
GND
ESD clamping test setup and waveforms
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
unclamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
IEC 61000-4-2 network
C
Z
= 150 pF; R
ESD TESTER
C
Z
R
Z
Z
= 330 Ω
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div
All information provided in this document is subject to legal disclaimers.
(Device
D.U.T.
Under
Test)
Rev. 3 — 31 May 2011
450 Ω
50 Ω coax
RG 223/U
GND
GND
GND
GND
clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
ATTENUATOR
10×
PESD1LIN (24V)
PESD1LIN (15V)
PESD1LIN (15V)
PESD1LIN (24V)
LIN-bus ESD protection diode
vertical scale = 20 V/div
horizontal scale = 50 ns/div
vertical scale = 20 V/div
horizontal scale = 50 ns/div
OSCILLOSCOPE
4 GHz DIGITAL
PESD1LIN
© NXP B.V. 2011. All rights reserved.
50 Ω
006aaa166
5 of 12

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