PESD1LIN NXP Semiconductors, PESD1LIN Datasheet - Page 2

• Manufacturer Part Number: PESD1LIN
• Description: PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
PESD1LIN
Product data sheet
Table 2.
Table 3.
Table 4.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Pin
1
2
Type number Package
PESD1LIN
Type number
PESD1LIN
Symbol
P
I
T
T
T
PP
j
amb
stg
PP
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Pinning
Ordering information
Marking codes
Limiting values
Parameter
peak pulse power
peak pulse current
junction temperature
ambient temperature
storage temperature
cathode 1 (15 V)
cathode 2 (24 V)
Description
Name
SC-76
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 31 May 2011
Description
plastic surface-mounted package; 2 leads
Conditions
t
t
p
p
= 8/20 s
= 8/20 s
Marking code
AM
Simplified outline
1
LIN-bus ESD protection diode
[1]
[1]
Min
-
-
-
65
65
2
PESD1LIN
Graphic symbol
© NXP B.V. 2011. All rights reserved.
Max
160
3
150
+150
+150
1
SOD323
Version
006aab041
Unit
W
A
C
C
C
2 of 12
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